Glass
The JASPER family is a suitable choice for everyone who requires high precision and high-speed marking, cutting, welding or 3D structures.
Drilling speed boost
60% reduction in drilling time per hole (from 1000 µs accelerated down to 400 µs through)
Record ablation rates
High-efficiency material removal exceeding 10 mm³/min using burst mode.
Flawless quality
100% crack-free bottom surfaces and negligible material redeposition due to tailored long-burst configurations
The ultrashort lasers offer tremendous advantages in processing transparent and brittle materials. A laser pulse is absorbed in nonlinear process inside the material – but only in the very localized volume around the focusing point. The surround material stays unaffected, thus heating or cracking may be eliminated, allowing for fine and very precise 3-D structures to be directly built inside.
Nowadays, glass is widely used in various products like smartphones/mobiles, laptops, televisions, medical devices and other consumer electronics.
Work with the right micromachining manufacture and micromachining laser today.
Femtosecond laser processing offers cost-effective services and solutions such as laser drilling, laser cutting, laser wielding, laser marking, surface structuring, polishing, engraving, and so on.
We can test it on your materials
Don’t guess - verify. We invite you to utilize our Ultrafast Laser Application Laboratory (ULAL) to test your samples.
1
Send us your specific material samples.
2
Define your desired outcome (perforation, texturizing, or marking).
3
Our engineers run series of tests to find the perfect parameters.
4
You receive a "proof of concept" before committing to a machine.