Efficient deep-hole drilling in glass substrates using femtosecond laser

How do you drill deep, narrow through-glass vias faster, cleaner and without cracks?

In this video, Bogusz Stępak, R&D Director of Laser Microprocessing at Fluence Technology, presents our latest results on high-aspect-ratio vias in glass – achieved without gigahertz burst, using an optimized single-pulse femtosecond process.

You’ll see:

• why major electronics players are shifting from silicon to glass

• the key challenges in deep glass drilling — and how to eliminate them

• the impact of pulse duration, focal plane position, NA and repetition rate

• how Jasper X1 achieves aspect ratios up to 27:1 with clean, stable hole walls

• when single-pulse drilling becomes 3–5× faster than gigahertz burst

• how advanced pulse-on-demand (jitter smaller than 50 ns) enables true on-the-fly drilling without stopping the scanner

If you work with high-density packaging, interposers, vias or glass micromachining – this is essential insight.